Dicing Tape Mount (Semi-Automatic Type)
A device for semi-automatically applying dicing tape to silicon wafers. It is a semi-auto type compatible with 12-inch wafers, providing supply of wafer frames and frame mounting.
● Maximum workpiece: 200-300mm ● Cycle time: 13 seconds per cycle ● Pressurization method: Air cylinder pressurization ● Cutting method: Automatic circular blade cutting ● Machine dimensions: W880×D720×H650mm ● Air source: Dry air 0.5Mpa ● Power supply: AC/100V 3A ● Weight: 120kg
- Company：エム・シー・ケー 東京 電子事業本部
- Price：Other
